340 Silicone Heat Sink Compound 5oz 142g (Dow Corning 340 Non Flowing) Suitable for Thermal Coupling of Electrical Devices and PCB Assemblies to Heat Sinks, Compliant with MIL-DTL-47113

Descripción

Products DOWSIL 340 Heat Sink Compound, White, non-curing and non-flowing thermally conductive compound.ApplicationDOWSIL 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks. It can also be used for effective thermal connection of many heat sinks that require effective cooling. and used for bases and mounting bolts of transistors, diodes and thyristor rectifiers.Features & BenefitsNon-flowingno need for ovens or curingHeat flow away from circuitry components can increase reliabilityPrincipleDow thermally conductive compounds are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance.ParametersColor:WhiteComponents:1 partViscosity :542,000Specific Gravity (Uncured): 2.1 Bleed:% 0.23Flash Point:>101.1 °CSpecific Gravity: 2.1Thermal Conductivity:0.67 W/mKVolume Resistivity:2 x 10^15 ohm-cm

Características

• 340 Silicone Heat Sink Compound: Compliant with MIL-DTL-47113, Thermal coupling, Heat Sink & Conductive, Non-flowing, Non-curing, Low bleed, Moderate thermal conductivity, No need for ovens or curing, Heat flow away from circuitry components can increase reliability. easy to app, can effectively protect the line, components.
• Application Principles：The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assemblies to the heat sink or chassis, thereby increasing the overall efficiency of the device. or PCB system assemblies are continually designed to deliver higher performance.Especially in the area of consumer devices, there is also a continual trend towards smaller, more compact designs.
• Product Characteristics: These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve thin Bond Line Thicknesses (BLTs) Designed for thermal coupling of electrical devices and PCB assemblies to heat sinks which can help to improve the transfer of heat away from the device, Ideal for assembly and repair of electronic components.
• Solvent Exposure: In general, the product is resistance to minimal or intermittent solvent exposure, however best practice is to avoid solvent exposure altogether.
• Typical Properties :Color: White, Dielectric Strength 210 V/mil.Thermal Conductivity:0.67 W/mK. Viscosity:542,000. Volume Resistivity:2 x 10^15 ohm-cm.

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