Almohadilla de soldadura sin costuras de 208 puntos para reparación de teléfonos móviles Accesorios para equipos terminales de soldadura 1,1 x 1,1 pulgadas para reparación de placa base

Descripción

BL-208 No-Trace Soldering Pad, Mobile Phone Repair Soldering Pad, Soldering Equipment Accessory, for Motherboard Solder Joint Repair Product Name: No-Trace Soldering Pad Material: Copper Dimensions: 1.1 x 1.1 inches Quantity: 208 pads Product Application: Used for motherboard solder joint repair, circuit jumper connections, and other soldering operations Note: Due to lighting conditions, monitor brightness, contrast settings, and other factors, the product image may differ slightly from the actual item. As measurements are taken manually, dimensions may vary by 1-2mm. Thank you for your understanding.

Características

• Product Packaging: Includes 208 soldering tips for mobile phone repairs and electronic component soldering. This ample quantity meets the various precision soldering needs of daily repairs.
• High Thermal Conductivity: Made from highly conductive copper, these tips offer excellent thermal conductivity, ensuring reliable connections and rapid heat transfer during soldering, effectively improving repair efficiency.
• Residue-Free Design: Each solder tip features a residue-free design, ensuring a clean and tidy soldering process. No residue is left behind after repairs, giving the finished result a more professional appearance.
• Easy to Use: The size and shape of the solder pads are carefully designed for precise placement and quick soldering, eliminating the need to wrap jumper wires and making daily repairs more convenient.
• Wide Compatibility: Compatible with common soldering equipment, suitable for smartphone motherboard repairs, jumper wire connections, and soldering various electronic components.

Especificaciones