Dow Corning 340 Silicone Heat Sink Compound 142g (5oz) Thermal Conductive Silicone Grease IGBT Heat Dissipation Paste for Electrical Devices PCB Assemblies and Computer CPU Non Flowing

Descripción

340 Heat Sink Compound: 5oz (142g)White, non-curing and non-flowing thermally conductive compound, suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks. used as a base seat and mounting bolt for transistors, diodes, and thyristor rectifiers. It is an ideal choice for heat dissipation in electronic chips and devices.Features & Benefits Non-flowing Moderate thermal conductivity No need for ovens or curing Heat flow away from circuitry components can increase reliability ApplicationsThermal management solutions: Helps heat flow from circuit components to the heat sink, lowering device temperature and extending service life.Electronic device assembly: Suitable for thermal coupling between PCB components and heat sinks, enhancing overall device efficiency.Industrial and automotive electronics: Provides stable thermal conductivity performance in high-temperature and high-humidity environments, ensuring reliable device operation.Transistor, diode, and thyristor rectifier bases and mounting bolts: Effectively connects heat sinks, providing a reliable thermal conductivity path.Heat sinks requiring effective cooling: Helps devices maintain stable operation under high-load conditions.Performance Data Viscosity: 542,000 cP or 542 Pa·s Density: 2.1 g/cm³Thermal conductivity: 0.67 W/m·K Thermal resistance (40 psi): 0.16 °C·cm²/W Gel penetration: 290 (1/10 mm) Evaporation resistance: 0.38% Dielectric strength: 210 V/mil Volume resistivity: 2 × 10¹⁵ Ω·cm Flash point: >101.1°C

Características

• 340 Heat Sink Compound: 5oz (142g), silicone thermal compound designed for efficient heat transfer between electrical devices, PCB assemblies, and heat sinks. It provides reliable thermal coupling. Ideal for heat dissipation of electronic chips and equipment.
• Applications: Used to thermally couple electrical components, PCBs, and heat sinks for improved heat dissipation.Ideal for compact, high-performance electronics, industrial equipment, and automotive applications.Helps reduce thermal resistance and improve device efficiency by directing heat away from critical components.
• Key Features: High thermal conductivity, high dielectric strength and Insulation Performance, non-flowing and non-curing, effectively transfers heat for reliable cooling, low bleed and high temperature stability, no need for ovens or curing, Provides excellent electrical insulation and safety.
• Performance Data: Thermal Conductivity: 0.67 W/m·K; Viscosity: 542,000 CP; Density: 2.1 g/cm³; Dielectric Strength: 210 V/mil; Volume Resistivity: 2 × 10¹⁵ Ω·cm; Color: White; Flash Point: >101.1°C
• Notes: Keep the product sealed in its original container to prevent contamination. Store in a cool, dry place and use within the product’s stated shelf life. Avoid prolonged or direct exposure to solvents.

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