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Product description Feature Nano particle structureFine-grained aluminum and zinc oxide contained in the paste interpolate the slight unevenness of the heat medium such as CPU and the heat sink, achieving excellent thermal conductivity. StabilityA special compound that does not dry at a high temperature of 80 ° C is used to maintain stable properties without curing for a long time. Non-conductiveThere is no concern about shorts due to non-conductivity. Easy to Apply Mainly used in computer CPU GPU PS4 LED... Thermal.With an ideal consistency, the HY883 thermal paste is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show you in the video.
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