2g Thermal Paste CPU, 8.5W/Mk Non-Conductive,Non-Capacitive

Descripción

Product description As a 19 years company, FEHONDA stands for the highest qualityin thermal products.We are dedicated to the mission of combining innovation and top performance. Our products are the result of careful research and development, coupled with engineering.Our solutions optimize heat dissipation and thus contribute to increased performance and longevity.

Características

• WIDE COMPATIBILITY: The wide working temperature range (-40℃-180℃) of the 2g cpu thermal paste makes it suitable for all electronic components in need of heat dissipation, such as CPUs, GPUs, processors, SSDs, and for PS4/PS5 consoles. Ideal for refurbishing, refreshing, and maintaining laptops.
• 8.5W/mK THERMAL CONDUCTIVITY: FEHONDA pasta termica formulated with high-content premium high thermal conductivity fillers help solve CPU thermal throttling and maintain the PC's full-load stability. Its excellent fluidity & compressibility ensure filling the tight gap for seamless heat conduction.
• EASY APPLICATION: The cpu paste is easy to apply with a spatula. Its ideal viscosity ensures the heat sink compound spreads smoothly and evenly for a consistent layer across the surface. You can also easily remove the pc thermal paste without leaving any residue when you need to wipe it off.
• NEVER LEAKAGE: A premium sealed bag paired with a sealing plug, the double-seal protection during storage or transportation, locks the thermal grease in freshness and prevents leakage. Simply reseal after partial use, keeping your thermal paste for cpu free from contamination and never going bad.
• MINIMUM PUMP-OUT EFFECT: The thermal compound's low-volatility silicone oil formulation resists oil-powder separation and evaporation, as demonstrated by a 1000+ cycle thermal shock test (on the pasta térmica) with no drying, no cracking, or no pump-out, ensuring long-term stable heat dissipation.

Especificaciones