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Product description Extreme Thermal Performance. Professional-Grade Results. Engineered for maximum heat transfer, PolarTronix Liquid Metal delivers ultra-low thermal resistance for CPUs, GPUs, and high-performance electronics. Designed for serious builders, repair professionals, and enthusiasts who demand the absolute best cooling efficiency. Manufactured with precision and packaged in the USA for reliability you can trust. Why Choose PolarTronix Liquid Metal? Ultra-High Thermal Conductivity Transfers heat significantly faster than traditional thermal paste for lower temps under load. Perfect for High-Performance Systems Ideal for gaming PCs, overclocked CPUs, GPUs, laptops, and consoles. Micro-Precision Syringe Controlled application for thin, even layers without waste. Trusted by Repair Professionals Built for serious builders and electronics technicians. Precision Application Made Simple Apply a small drop to the component surface and spread into a thin, even layer. A minimal amount provides maximum coverage. Proper surface preparation ensures optimal performance. For copper or nickel-plated surfaces only. Liquid Metal vs Traditional Thermal Paste Unlike conventional thermal pastes, liquid metal creates direct metallic contact between surfaces, drastically improving thermal transfer. The result? Lower temperatures, better sustained performance, and improved thermal stability under heavy workloads. Recommended for experienced users seeking maximum cooling efficiency. Choose the Right Cooling Solution for Your Build 1g PolarTronix Liquid Metal Thermal Paste for Computer CPU GPU Laptop 12.8W/mk Made in USA 4 Gram High Th... Add to Cart Add to Cart Customer Reviews 4.6 out of 5 stars 321 4.8 out of 5 stars 102 Price EUR 11.50EUR11.50 EUR 3.78EUR3.78 Thermal Performance Extreme Heat Transfer Efficiency Strong and Reliable Cooling Best For High-performance CPUs, GPUs, gaming builds, consoles Everyday systems, laptops, office PCS Application Skill Experienced Users Beginner Friendly Layer Thickness Ultra-Thin metallic interface Thin Paste Layer Long-Term Stability Long-Lasting when properly applied May require periodic reapplication Surface Compatibility Copper & Nickel-Plated Surfaces Broad Compatibility Overclocking Support Excellent for high thermal loads Suitable for moderate loads Appearance: Silver Liquid Metal Density: 6.44 g/cm3 (at 20°C) Melting point: 8°C Boiling Point: >2200°C Electrical conductivity: 3.4 X 10 6 S/m (at 20°C) Volatilization rate: <0.001% Thermal Conductivity: 130 W/mK
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